MC9S08QG8CDTE vs MC9S08EL16CTLR

This in-depth comparison of the MC9S08QG8CDTE and MC9S08EL16CTLR provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

ISO9001 Quality Control ISO45001 ISO14001 100% Genuine
Part A

MC9S08QG8CDTE

Freescale Semiconductor

Lifecycle
Active
Stock
4051 PCS
Package
TSSOP-16
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MC9S08EL16CTLR

NXP USA Inc.

Lifecycle
Active
Stock
2346 PCS
Package
TSSOP-28
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC9S08QG8CDTE MC9S08EL16CTLR
Supplier - Flip Electronics,NXP USA Inc.
Series S08 S08
Part Status Active Active
Core Processor S08 S08
Core Size 8-Bit 8-Bit
Speed 20MHz 40MHz
Connectivity I²C, SCI, SPI I²C, LINbus, SCI, SPI
Peripherals LVD, POR, PWM, WDT LVD, POR, PWM, WDT
Number of I/O 12 22
Program Memory Size 8KB (8K x 8) 16KB (16K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - 512 x 8
RAM Size 512 x 8 1K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V 2.7V ~ 5.5V
Data Converters A/D 8x10b A/D 16x10b
Oscillator Type Internal External
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
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