MC9S08QG8CDTER vs MC9S08EL16CTL

This in-depth comparison of the MC9S08QG8CDTER and MC9S08EL16CTL provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC9S08QG8CDTER

NXP USA Inc.

Lifecycle
Active
Stock
5686 PCS
Package
TSSOP-16
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MC9S08EL16CTL

NXP Semiconductors

Lifecycle
Active
Stock
6820 PCS
Package
TSSOP-28
Series
Embedded - Microcontrollers
+BOM RFQ

Need help validating a replacement?

Send your BOM and application constraints for technical and sourcing review.

RFQ Contact technical support

Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC9S08QG8CDTER MC9S08EL16CTL
Supplier - Rochester Electronics, LLC
Part Status Active Obsolete
Core Processor S08 HCS08
Core Size 8-Bit 8-Bit
Speed 20MHz 40MHz
Connectivity I²C, SCI, SPI I²C, LINbus, SCI, SPI
Peripherals LVD, POR, PWM, WDT LVD, POR, PWM, WDT
Number of I/O 12 22
Program Memory Size 8KB (8K x 8) 16KB (16K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - 512 x 8
RAM Size 512 x 8 1K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V 2.7V ~ 5.5V
Data Converters A/D 8x10b A/D 16x10b SAR
Oscillator Type Internal External, Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
Series S08 -
Compare RFQ