MC9S08SH4MTGR vs MC9S08RD32CDWE Comparison

This in-depth comparison of the MC9S08SH4MTGR and MC9S08RD32CDWE provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MC9S08SH4MTGR

+BOM

1756 PCS | NXP USA Inc.
MC9S08RD32CDWE

+BOM

3588 PCS | NXP USA Inc.
Package TSSOP-16 SOIC-28
Description IC MCU 8BIT 4KB FLASH 16TSSOP IC MCU 8BIT 32KB FLASH 28SOIC
Supplier - NXP USA Inc.
Series S08 S08
Part Status Active Obsolete
Core Processor S08 S08
Core Size 8-Bit 8-Bit
Speed 40MHz 8MHz
Connectivity I²C, LINbus, SCI, SPI SCI
Peripherals LVD, POR, PWM, WDT LVD, POR, PWM, WDT
Number of I/O 13 23
Program Memory Size 4KB (4K x 8) 32KB (32K x 8)
Program Memory Type FLASH FLASH
RAM Size 256 x 8 2K x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V 1.8V ~ 3.6V
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
Data Converters A/D 8x10b -
Comparison Model : MC9S08SH4MTGR MC9S08RD32CDWE

+BOM RFQ