MC9S08SH4MTGR vs MC9S08SE4CTGR

This in-depth comparison of the MC9S08SH4MTGR and MC9S08SE4CTGR provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC9S08SH4MTGR

NXP USA Inc.

Lifecycle
Active
Stock
1756 PCS
Package
TSSOP-16
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MC9S08SE4CTGR

NXP USA Inc.

Lifecycle
Active
Stock
5640 PCS
Package
TSSOP-16
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC9S08SH4MTGR MC9S08SE4CTGR
Supplier - NXP USA Inc.,Flip Electronics
Series S08 S08
Part Status Active Active
Core Processor S08 S08
Core Size 8-Bit 8-Bit
Speed 40MHz 20MHz
Connectivity I²C, LINbus, SCI, SPI LINbus, SCI
Peripherals LVD, POR, PWM, WDT LVD, POR, PWM
Number of I/O 13 14
Program Memory Size 4KB (4K x 8) 4KB (4K x 8)
Program Memory Type FLASH FLASH
RAM Size 256 x 8 256 x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V 2.7V ~ 5.5V
Data Converters A/D 8x10b A/D 8x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
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