MC9S12E128CFUE vs MC9S12D64CFU Comparison

This in-depth comparison of the MC9S12E128CFUE and MC9S12D64CFU provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MC9S12E128CFUE

+BOM

3792 PCS | NXP USA Inc.
MC9S12D64CFU

+BOM

6714 PCS | NXP USA Inc.
Package QFP-80
Description IC MCU 16BIT 128KB FLASH 80QFP IC MCU 16BIT 64KB FLASH 80QFP
Supplier - NXP USA Inc.
Series HCS12 HCS12
Part Status Active Obsolete
Core Processor HCS12 HCS12
Core Size 16-Bit 16-Bit
Speed 25MHz 25MHz
Connectivity EBI/EMI, I2C, SCI, SPI CANbus, I²C, SCI, SPI
Peripherals POR, PWM, WDT PWM, WDT
Number of I/O 60 59
Program Memory Size 128KB (128K x 8) 64KB (64K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - 1K x 8
RAM Size 8K x 8 4K x 8
Voltage - Supply (Vcc/Vdd) 2.35V ~ 2.75V 2.35V ~ 5.25V
Data Converters A/D 16x10b; D/A 2x8b A/D 16x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
Base Product Number MC9S12 -
Digi Key Programmable Not Verified -
Packaging Tray -
Comparison Model : MC9S12E128CFUE MC9S12D64CFU

+BOM RFQ