MC9S12E128CFUE vs MC9S12D64MFUE

This in-depth comparison of the MC9S12E128CFUE and MC9S12D64MFUE provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC9S12E128CFUE

NXP USA Inc.

Lifecycle
Active
Stock
3792 PCS
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MC9S12D64MFUE

NXP USA Inc.

Lifecycle
Active
Stock
6513 PCS
Package
QFP-80
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC9S12E128CFUE MC9S12D64MFUE
Supplier - Flip Electronics,NXP USA Inc.
Series HCS12 HCS12
Part Status Active Active
Core Processor HCS12 HCS12
Core Size 16-Bit 16-Bit
Speed 25MHz 25MHz
Connectivity EBI/EMI, I2C, SCI, SPI CANbus, I²C, SCI, SPI
Peripherals POR, PWM, WDT PWM, WDT
Number of I/O 60 59
Program Memory Size 128KB (128K x 8) 64KB (64K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - 1K x 8
RAM Size 8K x 8 4K x 8
Voltage - Supply (Vcc/Vdd) 2.35V ~ 2.75V 2.35V ~ 5.25V
Data Converters A/D 16x10b; D/A 2x8b A/D 16x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount
Base Product Number MC9S12 -
Digi Key Programmable Not Verified -
Packaging Tray -
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