MCF5208CVM166 vs MCF5235CVF150 Comparison

This in-depth comparison of the MCF5208CVM166 and MCF5235CVF150 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MCF5208CVM166

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1212 PCS | NXP USA Inc.
MCF5235CVF150

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8769 PCS | NXP USA Inc.
Package MAPBGA-196 LBGA-256
Description IC MCU 32BIT ROMLESS 196LBGA IC MCU 32BIT ROMLESS 256MAPBGA
Supplier - NXP USA Inc.
Series MCF520x MCF523x
Part Status Active Obsolete
Core Processor Coldfire V2 Coldfire V2
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 166.67MHz 150MHz
Connectivity EBI/EMI, Ethernet, I²C, SPI, UART/USART CANbus, EBI/EMI, Ethernet, I²C, SPI, UART/USART
Peripherals DMA, WDT DMA, WDT
Number of I/O 50 113
Program Memory Type ROMless ROMless
RAM Size 16K x 8 64K x 8
Voltage - Supply (Vcc/Vdd) 1.4V ~ 3.6V 1.4V ~ 1.6V
Oscillator Type External External
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
Comparison Model : MCF5208CVM166 MCF5235CVF150

+BOM RFQ