MCF5208CVM166 vs MCF5274LVF166 Comparison

This in-depth comparison of the MCF5208CVM166 and MCF5274LVF166 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MCF5208CVM166

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1212 PCS | NXP USA Inc.
MCF5274LVF166

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7259 PCS | NXP USA Inc.
Package MAPBGA-196 LBGA-196
Description IC MCU 32BIT ROMLESS 196LBGA IC MCU 32BIT ROMLESS 196MAPBGA
Supplier - NXP USA Inc.
Series MCF520x MCF527x
Part Status Active Not For New Designs
Core Processor Coldfire V2 Coldfire V2
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 166.67MHz 166MHz
Connectivity EBI/EMI, Ethernet, I²C, SPI, UART/USART EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
Peripherals DMA, WDT DMA, WDT
Number of I/O 50 61
Program Memory Type ROMless ROMless
RAM Size 16K x 8 64K x 8
Voltage - Supply (Vcc/Vdd) 1.4V ~ 3.6V 1.4V ~ 1.6V
Oscillator Type External External
Operating Temperature -40°C ~ 85°C (TA) 0°C ~ 70°C
Mounting Type Surface Mount Surface Mount
Comparison Model : MCF5208CVM166 MCF5274LVF166

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