MCF52110CAE66 vs MCF52210CAE80

This in-depth comparison of the MCF52110CAE66 and MCF52210CAE80 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MCF52110CAE66

NXP USA Inc.

Lifecycle
Active
Stock
3632 PCS
Package
LQFP-64
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MCF52210CAE80

Freescale Semiconductor

Lifecycle
Active
Stock
5054 PCS
Package
LQFP-64
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MCF52110CAE66 MCF52210CAE80
Supplier - Rochester Electronics, LLC
Series MCF521xx MCF5221x
Part Status Active Active
Core Processor Coldfire V2 Coldfire V2
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 66MHz 80MHz
Connectivity I²C, SPI, UART/USART I²C, SPI, UART/USART, USB OTG
Peripherals DMA, LVD, POR, PWM, WDT DMA, LVD, POR, PWM, WDT
Number of I/O 43 43
Program Memory Size 128KB (128K x 8) 64KB (64K x 8)
Program Memory Type FLASH FLASH
RAM Size 16K x 8 16K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V 3V ~ 3.6V
Data Converters A/D 8x12b A/D 8x12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C
Mounting Type Surface Mount Surface Mount
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