MCF52110CAE80 vs MCF5211CAE66

This in-depth comparison of the MCF52110CAE80 and MCF5211CAE66 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MCF52110CAE80

NXP USA Inc.

Lifecycle
Active
Stock
5044 PCS
Package
LQFP-64
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MCF5211CAE66

NXP USA Inc.

Lifecycle
Active
Stock
34 PCS
Package
LQFP-64
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MCF52110CAE80 MCF5211CAE66
Supplier - NXP USA Inc.
Series MCF521xx MCF521x
Part Status Active Not For New Designs
Core Processor Coldfire V2 Coldfire V2
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 80MHz 66MHz
Connectivity I²C, SPI, UART/USART I²C, SPI, UART/USART
Peripherals DMA, LVD, POR, PWM, WDT DMA, LVD, POR, PWM, WDT
Number of I/O 43 33
Program Memory Size 128KB (128K x 8) 128KB (128K x 8)
Program Memory Type FLASH FLASH
RAM Size 16K x 8 16K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V 3V ~ 3.6V
Data Converters A/D 8x12b A/D 8x12b
Oscillator Type Internal External
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
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