MCF5213LCVM80 vs MCF5274LVF166 Comparison

This in-depth comparison of the MCF5213LCVM80 and MCF5274LVF166 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MCF5213LCVM80

+BOM

7505 PCS | NXP USA Inc.
MCF5274LVF166

+BOM

7259 PCS | NXP USA Inc.
Package BGA-81 LBGA-196
Description IC MCU 32BIT 256KB FLSH 81MAPBGA IC MCU 32BIT ROMLESS 196MAPBGA
Supplier - NXP USA Inc.
Series MCF521x MCF527x
Part Status Not For New Designs Not For New Designs
Core Processor Coldfire V2 Coldfire V2
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 80MHz 166MHz
Connectivity CANbus, I²C, SPI, UART/USART EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
Peripherals DMA, LVD, POR, PWM, WDT DMA, WDT
Number of I/O 56 61
Program Memory Type FLASH ROMless
RAM Size 32K x 8 64K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V 1.4V ~ 1.6V
Oscillator Type Internal External
Operating Temperature -40°C ~ 85°C (TA) 0°C ~ 70°C
Mounting Type Surface Mount Surface Mount
Program Memory Size 256KB (256K x 8) -
Data Converters A/D 8x12b -
Comparison Model : MCF5213LCVM80 MCF5274LVF166

+BOM RFQ