MCF5213CAF66 vs MCF52223CAF80

This in-depth comparison of the MCF5213CAF66 and MCF52223CAF80 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MCF5213CAF66

NXP USA Inc.

Lifecycle
Active
Stock
1356 PCS
Package
LQFP-100
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MCF52223CAF80

Freescale Semiconductor

Lifecycle
Active
Stock
1539 PCS
Package
LQFP-100
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MCF5213CAF66 MCF52223CAF80
Series MCF521x MCF5222x
Part Status Not For New Designs Active
Core Processor Coldfire V2 Coldfire V2
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 66MHz 80MHz
Connectivity CANbus, I²C, SPI, UART/USART I²C, SPI, UART/USART, USB OTG
Peripherals DMA, LVD, POR, PWM, WDT DMA, LVD, POR, PWM, WDT
Number of I/O 55 56
Program Memory Size 256KB (256K x 8) 256KB (256K x 8)
Program Memory Type FLASH FLASH
RAM Size 32K x 8 32K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V 3V ~ 3.6V
Data Converters A/D 8x12b A/D 8x12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
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