MCF52233CAF60 vs MCF5208CAB166 Comparison

This in-depth comparison of the MCF52233CAF60 and MCF5208CAB166 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MCF52233CAF60

+BOM

3721 PCS | NXP USA Inc.
MCF5208CAB166

+BOM

9291 PCS | NXP USA Inc.
Package QFP-80 BQFP-160
Description IC MCU 32BIT 256KB FLASH 80LQFP IC MCU 32BIT ROMLESS 160QFP
Series MCF5223x MCF520x
Part Status Active Obsolete
Core Processor Coldfire V2 Coldfire V2
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 60MHz 166.67MHz
Connectivity Ethernet, I²C, SPI, UART/USART EBI/EMI, Ethernet, I²C, SPI, UART/USART
Peripherals DMA, LVD, POR, PWM, WDT DMA, WDT
Number of I/O 73 50
Program Memory Type FLASH ROMless
RAM Size 32K x 8 16K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V 1.4V ~ 3.6V
Oscillator Type Internal External
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
Program Memory Size 256KB (256K x 8) -
Data Converters A/D 8x12b -
Comparison Model : MCF52233CAF60 MCF5208CAB166

+BOM RFQ