MCF52259CAG80 vs MCF52268AG80

This in-depth comparison of the MCF52259CAG80 and MCF52268AG80 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MCF52259CAG80

Freescale Semiconductor

Lifecycle
Active
Stock
2381 PCS
Package
LQFP-144
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MCF52268AG80

NXP USA Inc.

Lifecycle
Active
Stock
4939 PCS
Package
LQFP-144
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MCF52259CAG80 MCF52268AG80
Supplier - NXP USA Inc.
Part Status Active Obsolete
Core Processor Coldfire V2 Coldfire V2
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 80MHz 80MHz
Connectivity CANbus, EBI/EMI, Ethernet, I²C, QSPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, QSPI, UART/USART, USB OTG
Peripherals DMA, LVD, POR, PWM, WDT DMA, LVD, POR, PWM, WDT
Number of I/O 96 96
Program Memory Size 512KB (512K x 8) 512KB (512K x 8)
Program Memory Type FLASH FLASH
RAM Size 64K x 8 64K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V 3V ~ 3.6V
Data Converters A/D 8x12b A/D 8x12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) 0°C ~ 70°C (TA)
Mounting Type Surface Mount Surface Mount
Series MCF5225x -
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