MCF5234CVM150 vs MCF5275LCVM166

This in-depth comparison of the MCF5234CVM150 and MCF5275LCVM166 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MCF5234CVM150

Freescale Semiconductor

Lifecycle
Active
Stock
4501 PCS
Package
MAPBGA-256
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MCF5275LCVM166

NXP USA Inc.

Lifecycle
Active
Stock
8315 PCS
Package
LBGA-196
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MCF5234CVM150 MCF5275LCVM166
Supplier - NXP USA Inc.
Series MCF523x MCF527x
Part Status Active Not For New Designs
Core Processor Coldfire V2 Coldfire V2
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 150MHz 166MHz
Connectivity CANbus, EBI/EMI, Ethernet, I²C, SPI, UART/USART EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
Peripherals DMA, WDT DMA, WDT
Number of I/O 97 61
Program Memory Type ROMless ROMless
RAM Size 64K x 8 64K x 8
Voltage - Supply (Vcc/Vdd) 1.4V ~ 1.6V 1.4V ~ 1.6V
Oscillator Type External External
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
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