MCF5235CVM150 vs MCF52221CVM66

This in-depth comparison of the MCF5235CVM150 and MCF52221CVM66 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MCF5235CVM150

NXP USA Inc.

Lifecycle
Active
Stock
6717 PCS
Package
BGA-256
Series
Embedded - Microprocessors
+BOM RFQ
Part B

MCF52221CVM66

NXP USA Inc.

Lifecycle
Active
Stock
2973 PCS
Package
LBGA-81
Series
Embedded - Microcontrollers
+BOM RFQ

Need help validating a replacement?

Send your BOM and application constraints for technical and sourcing review.

RFQ Contact technical support

Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MCF5235CVM150 MCF52221CVM66
Supplier - NXP USA Inc.
Series - MCF5222x
Part Status Active Obsolete
Core Processor - Coldfire V2
Core Size - 32-Bit Single-Core
Speed - 66MHz
Connectivity - I²C, SPI, UART/USART, USB OTG
Peripherals - DMA, LVD, POR, PWM, WDT
Number of I/O - 56
Program Memory Size - 128KB (128K x 8)
Program Memory Type - FLASH
RAM Size - 16K x 8
Voltage - Supply (Vcc/Vdd) - 3V ~ 3.6V
Data Converters - A/D 8x12b
Oscillator Type - Internal
Operating Temperature - -40°C ~ 85°C (TA)
Mounting Type - Surface Mount
Compare RFQ