MCF5235CVM150 vs MCF5275CVM166 Comparison

This in-depth comparison of the MCF5235CVM150 and MCF5275CVM166 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MCF5235CVM150

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6717 PCS | NXP USA Inc.
MCF5275CVM166

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5018 PCS | Freescale Semiconductor
Package BGA-256 LBGA-256
Description RISC MICROPROCESSOR, 32-BIT, COL IC MCU 32BIT ROMLESS 256MAPBGA
Supplier - Rochester Electronics, LLC
Part Status Active Active
Core Processor - Coldfire V2
Core Size - 32-Bit Single-Core
Speed - 166MHz
Connectivity - EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
Peripherals - DMA, WDT
Number of I/O - 69
Program Memory Type - ROMless
RAM Size - 64K x 8
Voltage - Supply (Vcc/Vdd) - 1.4V ~ 1.6V
Oscillator Type - External
Operating Temperature - -40°C ~ 85°C (TA)
Mounting Type - Surface Mount
Comparison Model : MCF5235CVM150 MCF5275CVM166

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