MCF5272CVM66 vs MCF5235CVM100

This in-depth comparison of the MCF5272CVM66 and MCF5235CVM100 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

ISO9001 Quality Control ISO45001 ISO14001 100% Genuine
Part A

MCF5272CVM66

NXP USA Inc.

Lifecycle
Active
Stock
1692 PCS
Package
SOT879-2
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MCF5235CVM100

Motorola

Lifecycle
Active
Stock
6128 PCS
Package
LBGA-256
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MCF5272CVM66 MCF5235CVM100
Supplier - Rochester Electronics, LLC
Series MCF527x MCF523x
Part Status Obsolete Obsolete
Core Processor Coldfire V2 Coldfire V2
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 66MHz 100MHz
Connectivity EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB CANbus, EBI/EMI, Ethernet, I²C, SPI, UART/USART
Peripherals DMA, WDT DMA, WDT
Number of I/O 32 113
Program Memory Type ROM ROMless
RAM Size 1K x 32 64K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V 1.4V ~ 1.6V
Oscillator Type External External
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
Program Memory Size 16KB (4K x 32) -
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