MCF5272VM66 vs MCF5212LCVM66

This in-depth comparison of the MCF5272VM66 and MCF5212LCVM66 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MCF5272VM66

NXP USA Inc.

Lifecycle
Active
Stock
2687 PCS
Package
BGA-196
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MCF5212LCVM66

NXP USA Inc.

Lifecycle
Active
Stock
3855 PCS
Package
LBGA-81
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MCF5272VM66 MCF5212LCVM66
Supplier - NXP USA Inc.
Series MCF527x MCF521x
Part Status Obsolete Not For New Designs
Core Processor Coldfire V2 Coldfire V2
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 66MHz 66MHz
Connectivity EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB I²C, SPI, UART/USART
Peripherals DMA, WDT DMA, LVD, POR, PWM, WDT
Number of I/O 32 56
Program Memory Size 16KB (4K x 32) 256KB (256K x 8)
Program Memory Type ROM FLASH
RAM Size 1K x 32 32K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V 3V ~ 3.6V
Data Converters - A/D 8x12b
Oscillator Type External Internal
Operating Temperature 0°C ~ 70°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
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