MCF5474VR266 vs MCF5472VR200 Comparison

This in-depth comparison of the MCF5474VR266 and MCF5472VR200 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MCF5474VR266

+BOM

3474 PCS | Flip Electronics
MCF5472VR200

+BOM

4020 PCS | NXP USA Inc.
Package BBGA-388
Description IC MPU ColdFire V4E 32Bit 1 Core IC MCU 32BIT ROMLESS 388PBGA
Supplier - Rochester Electronics, LLC,NXP USA Inc.
Series - MCF547x
Part Status Active Not For New Designs
Core Processor - Coldfire V4E
Core Size - 32-Bit Single-Core
Speed - 200MHz
Connectivity - EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
Peripherals - DMA, PWM, WDT
Number of I/O - 99
Program Memory Type - ROMless
RAM Size - 32K x 8
Voltage - Supply (Vcc/Vdd) - 1.43V ~ 1.58V
Oscillator Type - External
Operating Temperature - 0°C ~ 70°C (TA)
Mounting Type - Surface Mount
Packaging Tray -
Comparison Model : MCF5474VR266 MCF5472VR200

+BOM RFQ