MCIMX257CJM4A vs MCIMX253DVM4

This in-depth comparison of the MCIMX257CJM4A and MCIMX253DVM4 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MCIMX257CJM4A

Freescale Semiconductor

Lifecycle
Active
Stock
4997 PCS
Package
LFBGA-400
Series
Embedded - Microprocessors
+BOM RFQ
Part B

MCIMX253DVM4

NXP USA Inc.

Lifecycle
Active
Stock
3689 PCS
Package
LFBGA-400
Series
Embedded - Microprocessors
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MCIMX257CJM4A MCIMX253DVM4
Supplier - NXP USA Inc.
Series i.MX25 i.MX25
Part Status Active Obsolete
Core Processor ARM926EJ-S ARM926EJ-S
Number of Cores / Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 400MHz 400MHz
RAM Controllers LPDDR, DDR, DDR2 LPDDR, DDR, DDR2
Graphics Acceleration No No
Display&Interface Controllers Keypad, LCD, Touchscreen Keypad
Ethernet 10/100Mbps (1) 10/100Mbps (1)
USB USB 2.0 + PHY (2) USB 2.0 + PHY (2)
Voltage - I / O 2.0V, 2.5V, 2.7V, 3.0V, 3.3V 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Operating Temperature -40°C ~ 85°C (TA) -20°C ~ 70°C (TA)
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