MCIMX6G3CVM05AB vs MCIMX257CVM4

This in-depth comparison of the MCIMX6G3CVM05AB and MCIMX257CVM4 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MCIMX6G3CVM05AB

NXP USA Inc.

Lifecycle
Active
Stock
1627 PCS
Package
LFBGA-289
Series
Embedded - Microprocessors
+BOM RFQ
Part B

MCIMX257CVM4

Freescale Semiconductor

Lifecycle
Active
Stock
3159 PCS
Package
LFBGA-400
Series
Embedded - Microprocessors
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MCIMX6G3CVM05AB MCIMX257CVM4
Supplier - Rochester Electronics, LLC
Series i.MX6UL i.MX25
Part Status Active Obsolete
Core Processor ARM® Cortex®-A7 ARM926EJ-S
Number of Cores / Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 528MHz 400MHz
RAM Controllers LPDDR2, DDR3, DDR3L LPDDR, DDR, DDR2
Graphics Acceleration No No
Display&Interface Controllers LCD, LVDS Keypad, LCD, Touchscreen
Ethernet 10/100Mbps (2) 10/100Mbps (1)
USB USB 2.0 + PHY (2) USB 2.0 + PHY (2)
Voltage - I / O 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Operating Temperature -40°C ~ 105°C (TJ) -40°C ~ 85°C (TA)
Co - Processors / DSP Multimedia; NEON™ SIMD -
Security Features ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS -
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