MCIMX6Y2CVM05AB vs MCIMX6D6AVT08AE Comparison

This in-depth comparison of the MCIMX6D6AVT08AE and MCIMX6Y2CVM05AB provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MCIMX6D6AVT08AE

+BOM

7520 PCS | NXP USA Inc.
MCIMX6Y2CVM05AB

+BOM

6957 PCS | NXP USA Inc.
Package SOT1643-1 SOT1534-2
Description I.MX6D ROM PERF ENHAN I.MX6ULL ROM PERF ENHAN
Series i.MX6D i.MX6
Part Status Active Active
Core Processor ARM® Cortex®-A9 ARM® Cortex®-A7
Number of Cores / Bus Width 2 Core, 32-Bit 1 Core, 32-Bit
Speed 852MHz 528MHz
Co - Processors / DSP Multimedia; NEON™ SIMD Multimedia; NEON™ MPE
RAM Controllers LPDDR2, LVDDR3, DDR3 LPDDR2, DDR3, DDR3L
Graphics Acceleration Yes No
Display&Interface Controllers Keypad, LCD Electrophoretic, LCD
Ethernet 10/100/1000Mbps (1) 10/100Mbps (1)
SATA SATA 3Gbps (1) -
USB USB 2.0 + PHY (4) USB 2.0 OTG + PHY (2)
Voltage - I / O 1.8V, 2.5V, 2.8V, 3.3V 1.8V, 2.8V, 3.3V
Operating Temperature -40°C ~ 125°C (TJ) -40°C ~ 105°C (TJ)
Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection A-HAB, ARM TZ, CSU, SJC, SNVS
Comparison Model : MCIMX6D6AVT08AE MCIMX6Y2CVM05AB

+BOM RFQ