MCIMX6Y2DVM05AB vs MCIMX233CJM4CR2 Comparison

This in-depth comparison of the MCIMX6Y2DVM05AB and MCIMX233CJM4CR2 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MCIMX6Y2DVM05AB

+BOM

7488 PCS | NXP USA Inc.
MCIMX233CJM4CR2

+BOM

5307 PCS | NXP USA Inc.
Package MAPBGA-289 LFBGA-169
Description I.MX6ULL ROM PERF ENHAN IC MPU I.MX23 454MHZ 169MAPBGA
Supplier - NXP USA Inc.
Series i.MX6 i.MX23
Part Status Active Obsolete
Core Processor ARM® Cortex®-A7 ARM926EJ-S
Number of Cores / Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 528MHz 454MHz
Co - Processors / DSP Multimedia; NEON™ MPE Data; DCP
RAM Controllers LPDDR2, DDR3, DDR3L DRAM
Graphics Acceleration No No
Display&Interface Controllers Electrophoretic, LCD LCD, Touchscreen
USB USB 2.0 OTG + PHY (2) USB 2.0 + PHY (1)
Voltage - I / O 1.8V, 2.8V, 3.3V 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Operating Temperature 0°C ~ 95°C (TJ) -40°C ~ 85°C (TA)
Security Features A-HAB, ARM TZ, CSU, SJC, SNVS Cryptography, Hardware ID
Ethernet 10/100Mbps (2) -
Comparison Model : MCIMX6Y2DVM05AB MCIMX233CJM4CR2

+BOM RFQ