MCIMX257DJM4A vs MCIMX6Y2DVM05AB

This in-depth comparison of the MCIMX257DJM4A and MCIMX6Y2DVM05AB provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

ISO9001 Quality Control ISO45001 ISO14001 100% Genuine
Part A

MCIMX257DJM4A

Freescale Semiconductor

Lifecycle
Active
Stock
3786 PCS
Package
MAPBGA-400
Series
Embedded - Microprocessors
+BOM RFQ
Part B

MCIMX6Y2DVM05AB

NXP USA Inc.

Lifecycle
Active
Stock
7488 PCS
Package
MAPBGA-289
Series
Embedded - Microprocessors
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MCIMX257DJM4A MCIMX6Y2DVM05AB
Series i.MX25 i.MX6
Part Status Active Active
Core Processor ARM926EJ-S ARM® Cortex®-A7
Number of Cores / Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 400MHz 528MHz
RAM Controllers LPDDR, DDR, DDR2 LPDDR2, DDR3, DDR3L
Graphics Acceleration No No
Display&Interface Controllers Keypad, LCD, Touchscreen Electrophoretic, LCD
Ethernet 10/100Mbps (1) 10/100Mbps (2)
USB USB 2.0 + PHY (2) USB 2.0 OTG + PHY (2)
Voltage - I / O 2.0V, 2.5V, 2.7V, 3.0V, 3.3V 1.8V, 2.8V, 3.3V
Operating Temperature -20°C ~ 70°C (TA) 0°C ~ 95°C (TJ)
Co - Processors / DSP - Multimedia; NEON™ MPE
Security Features - A-HAB, ARM TZ, CSU, SJC, SNVS
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