MCIMX6Y2DVM05AB vs MCIMX537CVP8C2 Comparison

This in-depth comparison of the MCIMX537CVP8C2 and MCIMX6Y2DVM05AB provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MCIMX537CVP8C2

+BOM

2881 PCS | NXP USA Inc.
MCIMX6Y2DVM05AB

+BOM

7488 PCS | NXP USA Inc.
Package TEPBGA-529 MAPBGA-289
Description IC MPU 32BIT ARM 529PBGA I.MX6ULL ROM PERF ENHAN
Series i.MX53 i.MX6
Part Status Active Active
Core Processor ARM® Cortex®-A8 ARM® Cortex®-A7
Number of Cores / Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 800MHz 528MHz
Co - Processors / DSP Multimedia; NEON™ SIMD Multimedia; NEON™ MPE
RAM Controllers LPDDR2, DDR2, DDR3 LPDDR2, DDR3, DDR3L
Graphics Acceleration Yes No
Display&Interface Controllers Keypad, LCD, LVDS Electrophoretic, LCD
Ethernet 10/100Mbps (1) 10/100Mbps (2)
SATA SATA 1.5Gbps (1) -
USB USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) USB 2.0 OTG + PHY (2)
Voltage - I / O 1.3V, 1.8V, 2.775V, 3.3V 1.8V, 2.8V, 3.3V
Operating Temperature -40°C ~ 125°C (TJ) 0°C ~ 95°C (TJ)
Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection A-HAB, ARM TZ, CSU, SJC, SNVS
Comparison Model : MCIMX537CVP8C2 MCIMX6Y2DVM05AB

+BOM RFQ