MCIMX6Y2DVM05AB vs MCIMX6L3EVN10AA Comparison

This in-depth comparison of the MCIMX6Y2DVM05AB and MCIMX6L3EVN10AA provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MCIMX6Y2DVM05AB

+BOM

7488 PCS | NXP USA Inc.
MCIMX6L3EVN10AA

+BOM

4300 PCS | NXP USA Inc.
Package MAPBGA-289 TFBGA-432
Description I.MX6ULL ROM PERF ENHAN IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Supplier - NXP USA Inc.
Series i.MX6 i.MX6SL
Part Status Active Obsolete
Core Processor ARM® Cortex®-A7 ARM® Cortex®-A9
Number of Cores / Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 528MHz 1.0GHz
Co - Processors / DSP Multimedia; NEON™ MPE Multimedia; NEON™ SIMD
RAM Controllers LPDDR2, DDR3, DDR3L LPDDR2, LVDDR3, DDR3
Graphics Acceleration No Yes
Display&Interface Controllers Electrophoretic, LCD Keypad, LCD
Ethernet 10/100Mbps (2) 10/100Mbps (1)
USB USB 2.0 OTG + PHY (2) USB 2.0 + PHY (3)
Voltage - I / O 1.8V, 2.8V, 3.3V 1.2V, 1.8V, 3.0V
Operating Temperature 0°C ~ 95°C (TJ) -40°C ~ 105°C (TA)
Security Features A-HAB, ARM TZ, CSU, SJC, SNVS ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Comparison Model : MCIMX6Y2DVM05AB MCIMX6L3EVN10AA

+BOM RFQ