MCIMX6Z0DVM09AB vs MCIMX253DVM4

This in-depth comparison of the MCIMX6Z0DVM09AB and MCIMX253DVM4 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MCIMX6Z0DVM09AB

NXP USA Inc.

Lifecycle
Active
Stock
5758 PCS
Package
LFBGA-289
Series
Embedded - Microprocessors
+BOM RFQ
Part B

MCIMX253DVM4

NXP USA Inc.

Lifecycle
Active
Stock
3689 PCS
Package
LFBGA-400
Series
Embedded - Microprocessors
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MCIMX6Z0DVM09AB MCIMX253DVM4
Supplier - NXP USA Inc.
Series i.MX6 i.MX25
Part Status Active Obsolete
Core Processor ARM® Cortex®-A7 ARM926EJ-S
Number of Cores / Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 900MHz 400MHz
RAM Controllers LPDDR2, DDR3, DDR3L LPDDR, DDR, DDR2
Graphics Acceleration No No
Display&Interface Controllers Keypad Keypad
Ethernet - 10/100Mbps (1)
USB USB 2.0 OTG + PHY (2) USB 2.0 + PHY (2)
Voltage - I / O - 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Operating Temperature 0°C ~ 95°C (TJ) -20°C ~ 70°C (TA)
Co - Processors / DSP Multimedia; NEON™ SIMD -
Security Features A-HAB, ARM TZ, CSU, SJC, SNVS -
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