MCIMX6Z0DVM09AB vs MCIMX6G3CVM05AB Comparison

This in-depth comparison of the MCIMX6G3CVM05AB and MCIMX6Z0DVM09AB provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MCIMX6G3CVM05AB

+BOM

1627 PCS | NXP USA Inc.
MCIMX6Z0DVM09AB

+BOM

5758 PCS | NXP USA Inc.
Package LFBGA-289 LFBGA-289
Description IC MPU I.MX6UL 289BGA IC MPU I.MX6ULZ 900MHZ 289MAPBGA
Series i.MX6UL i.MX6
Part Status Active Active
Core Processor ARM® Cortex®-A7 ARM® Cortex®-A7
Number of Cores / Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 528MHz 900MHz
Co - Processors / DSP Multimedia; NEON™ SIMD Multimedia; NEON™ SIMD
RAM Controllers LPDDR2, DDR3, DDR3L LPDDR2, DDR3, DDR3L
Graphics Acceleration No No
Display&Interface Controllers LCD, LVDS Keypad
Ethernet 10/100Mbps (2) -
USB USB 2.0 + PHY (2) USB 2.0 OTG + PHY (2)
Voltage - I / O 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V -
Operating Temperature -40°C ~ 105°C (TJ) 0°C ~ 95°C (TJ)
Security Features ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS A-HAB, ARM TZ, CSU, SJC, SNVS
Comparison Model : MCIMX6G3CVM05AB MCIMX6Z0DVM09AB

+BOM RFQ