MCIMX7D2DVM12SD vs MCIMX257DVM4

This in-depth comparison of the MCIMX7D2DVM12SD and MCIMX257DVM4 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MCIMX7D2DVM12SD

NXP USA Inc.

Lifecycle
Active
Stock
1883 PCS
Package
LFBGA-541
Series
Embedded - Microprocessors
+BOM RFQ
Part B

MCIMX257DVM4

NXP USA Inc.

Lifecycle
Active
Stock
9624 PCS
Package
LFBGA-400
Series
Embedded - Microprocessors
+BOM RFQ

Need help validating a replacement?

Send your BOM and application constraints for technical and sourcing review.

RFQ Contact technical support

Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MCIMX7D2DVM12SD MCIMX257DVM4
Supplier - NXP USA Inc.
Series i.MX7D i.MX25
Part Status Active Obsolete
Core Processor ARM® Cortex®-A7, ARM® Cortex®-M4 ARM926EJ-S
Number of Cores / Bus Width 2 Core, 32-Bit 1 Core, 32-Bit
Speed 1.2GHz 400MHz
RAM Controllers LPDDR2, LPDDR3, DDR3, DDR3L LPDDR, DDR, DDR2
Graphics Acceleration No No
Display&Interface Controllers Keypad, LCD, MIPI Keypad, LCD, Touchscreen
Ethernet 10/100/1000Mbps (2) 10/100Mbps (1)
USB USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) USB 2.0 + PHY (2)
Voltage - I / O 1.8V, 3.3V 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Operating Temperature 0°C ~ 85°C (TJ) -20°C ~ 70°C (TA)
Co - Processors / DSP Multimedia; NEON™ MPE -
Security Features A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS -
Compare RFQ