MCP47FEB12A0-E/ST vs MCP47FEB01A3-E/ST

This in-depth comparison of the MCP47FEB12A0-E/ST and MCP47FEB01A3-E/ST provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MCP47FEB12A0-E/ST

Microchip Technology

Lifecycle: Active
Stock: 3223 PCS
Package: TSSOP-8
Series: Data Acquisition - Digital to Analog Converters (DAC)

+BOM RFQ

Part B

MCP47FEB01A3-E/ST

Microchip Technology

Lifecycle: Active
Stock: 2914 PCS
Package: TSSOP-8
Series: Data Acquisition - Digital to Analog Converters (DAC)

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	MCP47FEB12A0-E/ST	MCP47FEB01A3-E/ST
Supplier	Microchip Technology	Microchip Technology
Part Status	Active	Active
Number of Bits	10	8
Number of D/A Converters	2	1
Settling Time	6µs (Typ)	6µs (Typ)
Output Type	Voltage - Buffered	Voltage - Buffered
Differential Output	No	No
Data Interface	I²C	I²C
Reference Type	External, Internal, Supply	External, Internal, Supply
Voltage - Supply, Analog	2.7V ~ 5.5V	2.7V ~ 5.5V
Voltage - Supply, Digital	2.7V ~ 5.5V	2.7V ~ 5.5V
INL / DNL(LSB)	±0.4, ±0.05	±0.1, ±0.0125
Architecture	R-2R	R-2R
Operating Temperature	-40°C ~ 125°C	-40°C ~ 125°C

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