MMC2114CFCAG33 vs MMC2114CFCPU33

This in-depth comparison of the MMC2114CFCAG33 and MMC2114CFCPU33 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MMC2114CFCAG33

Freescale Semiconductor

Lifecycle
Active
Stock
4203 PCS
Package
LQFP-144
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MMC2114CFCPU33

NXP USA Inc.

Lifecycle
Active
Stock
9230 PCS
Package
LQFP-100
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MMC2114CFCAG33 MMC2114CFCPU33
Supplier - NXP USA Inc.
Series MCore MCore
Part Status Active Obsolete
Core Processor M210 M210
Core Size 16/32-Bit 16/32-Bit
Speed 33MHz 33MHz
Connectivity EBI/EMI, SCI, SPI EBI/EMI, SCI, SPI
Peripherals LVD, POR, PWM, WDT LVD, POR, PWM, WDT
Number of I/O 67 67
Program Memory Size 256KB (256K x 8) 256KB (256K x 8)
Program Memory Type FLASH FLASH
RAM Size 32K x 8 32K x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 3.6V 2.7V ~ 3.6V
Data Converters A/D 8x10b A/D 8x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
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