MPC5554MZP80 vs MPC5534MVM80

This in-depth comparison of the MPC5554MZP80 and MPC5534MVM80 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MPC5554MZP80

NXP USA Inc.

Lifecycle
Active
Stock
2417 PCS
Package
BGA-416
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MPC5534MVM80

NXP USA Inc.

Lifecycle
Active
Stock
5899 PCS
Package
BGA-208
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MPC5554MZP80 MPC5534MVM80
Series MPC55xx Qorivva MPC55xx Qorivva
Part Status Not For New Designs Not For New Designs
Core Processor e200z6 e200z6
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 82MHz 80MHz
Connectivity CANbus, EBI/EMI, SCI, SPI CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals DMA, POR, PWM, WDT DMA, POR, PWM, WDT
Number of I/O 256 192
Program Memory Size 2MB (2M x 8) 1MB (1M x 8)
Program Memory Type FLASH FLASH
RAM Size 64K x 8 64K x 8
Voltage - Supply (Vcc/Vdd) 1.35V ~ 1.65V 1.35V ~ 1.65V
Data Converters A/D 40x12b A/D 34x12b
Oscillator Type External External
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount
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