MPC555LFMVR40 vs MPC5554MZP112

This in-depth comparison of the MPC555LFMVR40 and MPC5554MZP112 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MPC555LFMVR40

Freescale Semiconductor

Lifecycle
Active
Stock
6456 PCS
Package
BGA-272
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MPC5554MZP112

NXP USA Inc.

Lifecycle
Active
Stock
6683 PCS
Package
BBGA-416
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MPC555LFMVR40 MPC5554MZP112
Supplier - NXP USA Inc.
Series MPC5xx MPC55xx Qorivva
Part Status Active Not For New Designs
Core Processor PowerPC e200z6
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 40MHz 112MHz
Connectivity CANbus, EBI/EMI, SCI, SPI, UART/USART CANbus, EBI/EMI, SCI, SPI
Peripherals POR, PWM, WDT DMA, POR, PWM, WDT
Number of I/O 101 256
Program Memory Size 448KB (448K x 8) 2MB (2M x 8)
Program Memory Type FLASH FLASH
RAM Size 26K x 8 64K x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V 1.35V ~ 1.65V
Data Converters A/D 32x10b A/D 40x12b
Oscillator Type External External
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount
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