MPC555LFMZP40 vs MPC5534MVM80

This in-depth comparison of the MPC555LFMZP40 and MPC5534MVM80 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MPC555LFMZP40

NXP USA Inc.

Lifecycle
Active
Stock
2847 PCS
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MPC5534MVM80

NXP USA Inc.

Lifecycle
Active
Stock
5899 PCS
Package
BGA-208
Series
Embedded - Microcontrollers
+BOM RFQ

Need help validating a replacement?

Send your BOM and application constraints for technical and sourcing review.

RFQ Contact technical support

Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MPC555LFMZP40 MPC5534MVM80
Series MPC5xx MPC55xx Qorivva
Part Status Obsolete Not For New Designs
Core Processor PowerPC e200z6
Core Size 32-Bit 32-Bit Single-Core
Speed 40MHz 80MHz
Connectivity CANbus, EBI/EMI, SCI, SPI, UART/USART CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals POR, PWM, WDT DMA, POR, PWM, WDT
Number of I/O 101 192
Program Memory Size 448KB (448K x 8) 1MB (1M x 8)
Program Memory Type FLASH FLASH
RAM Size 26K x 8 64K x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V 1.35V ~ 1.65V
Data Converters A/D 32x10b A/D 34x12b
Oscillator Type External External
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount
Base Product Number MPC555 -
Digi Key Programmable Not Verified -
Packaging Tray -
Compare RFQ