MPC565MZP56 vs MPC563MVR56R2

This in-depth comparison of the MPC565MZP56 and MPC563MVR56R2 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MPC565MZP56

NXP USA Inc.

Lifecycle
Active
Stock
2545 PCS
Package
SOT1712-1
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MPC563MVR56R2

NXP USA Inc.

Lifecycle
Active
Stock
6153 PCS
Package
BBGA-388
Series
Embedded - Microcontrollers
+BOM RFQ

Need help validating a replacement?

Send your BOM and application constraints for technical and sourcing review.

RFQ Contact technical support

Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MPC565MZP56 MPC563MVR56R2
Supplier - NXP USA Inc.
Series MPC5xx MPC5xx
Part Status Not For New Designs Obsolete
Core Processor PowerPC PowerPC
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 56MHz 56MHz
Connectivity CANbus, EBI/EMI, SCI, SPI, UART/USART CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals POR, PWM, WDT POR, PWM, WDT
Number of I/O 56 56
Program Memory Size 1MB (1M x 8) 512KB (512K x 8)
Program Memory Type FLASH FLASH
RAM Size 36K x 8 32K x 8
Voltage - Supply (Vcc/Vdd) 2.5V ~ 2.7V 2.5V ~ 2.7V
Data Converters A/D 40x10b A/D 32x10b
Oscillator Type External External
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount
Compare RFQ