MPC8245LZU266D vs MPC8245TVV350D

This in-depth comparison of the MPC8245LZU266D and MPC8245TVV350D provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MPC8245LZU266D

NXP USA Inc.

Lifecycle: Active
Stock: 2869 PCS
Package: LBGA-352
Series: Embedded - Microprocessors

+BOM RFQ

Part B

MPC8245TVV350D

NXP USA Inc.

Lifecycle: Active
Stock: 4370 PCS
Package: LBGA-352
Series: Embedded - Microprocessors

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	MPC8245LZU266D	MPC8245TVV350D
Supplier	-	Flip Electronics,NXP USA Inc.
Series	MPC82xx	MPC82xx
Part Status	Obsolete	Obsolete
Core Processor	PowerPC 603e	PowerPC 603e
Number of Cores / Bus Width	1 Core, 32-Bit	1 Core, 32-Bit
Speed	266MHz	350MHz
RAM Controllers	SDRAM	SDRAM
Graphics Acceleration	No	No
Voltage - I / O	3.3V	3.3V
Operating Temperature	0°C ~ 105°C (TA)	-40°C ~ 105°C (TA)

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