MPC8247CVRTIEA vs MPC823ZQ66B2T

This in-depth comparison of the MPC8247CVRTIEA and MPC823ZQ66B2T provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MPC8247CVRTIEA

NXP USA Inc.

Lifecycle
Active
Stock
2680 PCS
Package
BGA-516
Series
Embedded - Microprocessors
+BOM RFQ
Part B

MPC823ZQ66B2T

NXP USA Inc.

Lifecycle
Active
Stock
8216 PCS
Package
BBGA-256
Series
Embedded - Microprocessors
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MPC8247CVRTIEA MPC823ZQ66B2T
Supplier - Flip Electronics,NXP USA Inc.
Series MPC82xx MPC8xx
Part Status Active Obsolete
Core Processor PowerPC G2_LE PowerPC
Number of Cores / Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 400MHz 66MHz
Co - Processors / DSP Communications; RISC CPM Communications; RISC CPM
RAM Controllers DRAM, SDRAM DRAM
Graphics Acceleration No No
Display&Interface Controllers - LCD, Video
Ethernet 10/100Mbps (2) 10Mbps (1)
USB USB 2.0 (1) USB 1.x (1)
Voltage - I / O 3.3V 3.3V
Operating Temperature -40°C ~ 105°C (TA) 0°C ~ 95°C (TA)
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