MPC8247VRTIEA vs MPC8247CZQTIEA

This in-depth comparison of the MPC8247VRTIEA and MPC8247CZQTIEA provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MPC8247VRTIEA

NXP USA Inc.

Lifecycle
Active
Stock
5118 PCS
Package
PBGA-516
Series
Embedded - Microprocessors
+BOM RFQ
Part B

MPC8247CZQTIEA

NXP USA Inc.

Lifecycle
Active
Stock
240 PCS
Package
BBGA-516
Series
Embedded - Microprocessors
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MPC8247VRTIEA MPC8247CZQTIEA
Supplier - Flip Electronics,NXP USA Inc.
Series MPC82xx MPC82xx
Part Status Active Obsolete
Core Processor PowerPC G2_LE PowerPC G2_LE
Number of Cores / Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 400MHz 400MHz
Co - Processors / DSP Communications; RISC CPM Communications; RISC CPM
RAM Controllers DRAM, SDRAM DRAM, SDRAM
Graphics Acceleration No No
Ethernet 10/100Mbps (2) 10/100Mbps (2)
USB USB 2.0 (1) USB 2.0 (1)
Voltage - I / O 3.3V 3.3V
Operating Temperature 0°C ~ 105°C (TA) -40°C ~ 105°C (TA)
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