MPC8270VVUPEA vs MPC8255AVVMHBB

This in-depth comparison of the MPC8270VVUPEA and MPC8255AVVMHBB provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MPC8270VVUPEA

+BOM

7726 PCS | Nexperia USA Inc.
MPC8255AVVMHBB

+BOM

3526 PCS | NXP USA Inc.
Package SOT1752-1 480-LBGA Exposed Pad
Description POWERQUICC 32 BIT POWER ARCHITEC IC MPU MPC82XX 266MHZ 480TBGA
Supplier - NXP USA Inc.
Series - MPC82xx
ProductStatus Obsolete Obsolete
CoreProcessor PowerPC G2_LE PowerPC G2
NumberofCores/BusWidth 1 Core, 32-Bit 1 Core, 32-Bit
Speed 300MHz 266MHz
Co-Processors/DSP Communications; RISC CPM Communications; RISC CPM
RAMControllers DRAM, SDRAM DRAM, SDRAM
GraphicsAcceleration No No
Ethernet 10/100Mbps (3) 10/100Mbps (3)
Voltage-I/O 3.3V 3.3V
OperatingTemperature 0°C ~ 105°C (TJ) 0°C ~ 105°C (TA)
USB USB 2.0 (1) -
Comparison Model : MPC8270VVUPEA MPC8255AVVMHBB

+BOM RFQ