MPC850DEVR50BU vs MPC850CVR50BUR2 Comparison

This in-depth comparison of the MPC850DEVR50BU and MPC850CVR50BUR2 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MPC850DEVR50BU

+BOM

3164 PCS | NXP USA Inc.
MPC850CVR50BUR2

+BOM

7579 PCS | NXP USA Inc.
Package BBGA-256 BBGA-256
Description IC MPU MPC8XX 50MHZ 256BGA IC MPU MPC8XX 50MHZ 256BGA
Supplier Rochester Electronics, LLC,NXP USA Inc. NXP USA Inc.
Series MPC8xx MPC8xx
Part Status Obsolete Obsolete
Core Processor MPC8xx MPC8xx
Number of Cores / Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 50MHz 50MHz
Co - Processors / DSP Communications; CPM Communications; CPM
RAM Controllers DRAM DRAM
Graphics Acceleration No No
Ethernet 10Mbps (1) 10Mbps (1)
USB USB 1.x (1) USB 1.x (1)
Voltage - I / O 3.3V 3.3V
Operating Temperature 0°C ~ 95°C (TA) -40°C ~ 95°C (TA)
Comparison Model : MPC850DEVR50BU MPC850CVR50BUR2

+BOM RFQ