MPC850DEZQ50BU vs MPC850DEVR80BU

This in-depth comparison of the MPC850DEZQ50BU and MPC850DEVR80BU provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MPC850DEZQ50BU

+BOM

5448 PCS | NXP USA Inc.
MPC850DEVR80BU

+BOM

3148 PCS | NXP USA Inc.
Package BBGA-256 BBGA-256
Description IC MPU MPC8XX 50MHZ 256BGA IC MPU MPC8XX 80MHZ 256BGA
Supplier - NXP USA Inc.
Series MPC8xx MPC8xx
ProductStatus Obsolete Obsolete
CoreProcessor MPC8xx MPC8xx
NumberofCores/BusWidth 1 Core, 32-Bit 1 Core, 32-Bit
Speed 50MHz 80MHz
Co-Processors/DSP Communications; CPM Communications; CPM
RAMControllers DRAM DRAM
GraphicsAcceleration No No
Ethernet 10Mbps (1) 10Mbps (1)
USB USB 1.x (1) USB 1.x (1)
Voltage-I/O 3.3V 3.3V
OperatingTemperature 0°C ~ 95°C (TA) 0°C ~ 95°C (TA)
Comparison Model : MPC850DEZQ50BU MPC850DEVR80BU

+BOM RFQ