MPC850DEZQ50BU vs MPC852TZT100A

This in-depth comparison of the MPC850DEZQ50BU and MPC852TZT100A provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MPC850DEZQ50BU

NXP USA Inc.

Lifecycle
Active
Stock
5448 PCS
Package
BBGA-256
Series
Embedded - Microprocessors
+BOM RFQ
Part B

MPC852TZT100A

NXP USA Inc.

Lifecycle
Active
Stock
2570 PCS
Package
BBGA-256
Series
Embedded - Microprocessors
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MPC850DEZQ50BU MPC852TZT100A
Supplier - NXP USA Inc.
Series MPC8xx MPC8xx
Part Status Obsolete Obsolete
Core Processor MPC8xx MPC8xx
Number of Cores / Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 50MHz 100MHz
Co - Processors / DSP Communications; CPM Communications; CPM
RAM Controllers DRAM DRAM
Graphics Acceleration No No
Ethernet 10Mbps (1) 10Mbps (1)
Voltage - I / O 3.3V 3.3V
Operating Temperature 0°C ~ 95°C (TA) 0°C ~ 95°C (TA)
USB USB 1.x (1) -
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