MPC850DEZQ50BU vs MPC8555EPXAKE

This in-depth comparison of the MPC850DEZQ50BU and MPC8555EPXAKE provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

ISO9001 Quality Control ISO45001 ISO14001 100% Genuine
Part A

MPC850DEZQ50BU

NXP USA Inc.

Lifecycle
Active
Stock
5448 PCS
Package
BBGA-256
Series
Embedded - Microprocessors
+BOM RFQ
Part B

MPC8555EPXAKE

NXP USA Inc.

Lifecycle
Active
Stock
2923 PCS
Package
BBGA-783
Series
Embedded - Microprocessors
+BOM RFQ

Need help validating a replacement?

Send your BOM and application constraints for technical and sourcing review.

RFQ Contact technical support

Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MPC850DEZQ50BU MPC8555EPXAKE
Supplier - NXP USA Inc.
Series MPC8xx MPC85xx
Part Status Obsolete Obsolete
Core Processor MPC8xx PowerPC e500
Number of Cores / Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 50MHz 600MHz
Co - Processors / DSP Communications; CPM Communications; CPM, Security; SEC
RAM Controllers DRAM DDR, SDRAM
Graphics Acceleration No No
Ethernet 10Mbps (1) 10/100/1000Mbps (2)
USB USB 1.x (1) USB 2.0 (1)
Voltage - I / O 3.3V 2.5V, 3.3V
Operating Temperature 0°C ~ 95°C (TA) 0°C ~ 105°C (TA)
Security Features - Cryptography, Random Number Generator
Compare RFQ