MPC850DEZQ50BU vs MPC8555EVTAPF

This in-depth comparison of the MPC8555EVTAPF and MPC850DEZQ50BU provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MPC8555EVTAPF

+BOM

7935 PCS | NXP USA Inc.
MPC850DEZQ50BU

+BOM

5448 PCS | NXP USA Inc.
Package BBGA-783 BBGA-256
Description IC MPU MPC85XX 833MHZ 783FCBGA IC MPU MPC8XX 50MHZ 256BGA
Supplier Flip Electronics,NXP USA Inc. -
Series MPC85xx MPC8xx
ProductStatus Obsolete Obsolete
CoreProcessor PowerPC e500 MPC8xx
NumberofCores/BusWidth 1 Core, 32-Bit 1 Core, 32-Bit
Speed 833MHz 50MHz
Co-Processors/DSP Communications; CPM, Security; SEC Communications; CPM
RAMControllers DDR, SDRAM DRAM
GraphicsAcceleration No No
Ethernet 10/100/1000Mbps (2) 10Mbps (1)
USB USB 2.0 (1) USB 1.x (1)
Voltage-I/O 2.5V, 3.3V 3.3V
OperatingTemperature 0°C ~ 105°C (TA) 0°C ~ 95°C (TA)
SecurityFeatures Cryptography, Random Number Generator -
Comparison Model : MPC8555EVTAPF MPC850DEZQ50BU

+BOM RFQ