MPC8560VT833LC vs MPC850SRVR50BU

This in-depth comparison of the MPC8560VT833LC and MPC850SRVR50BU provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MPC8560VT833LC

NXP USA Inc.

Lifecycle
Active
Stock
2911 PCS
Package
BBGA-784
Series
Embedded - Microprocessors
+BOM RFQ
Part B

MPC850SRVR50BU

NXP USA Inc.

Lifecycle
Active
Stock
29 PCS
Package
BBGA-256
Series
Embedded - Microprocessors
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MPC8560VT833LC MPC850SRVR50BU
Supplier - Rochester Electronics, LLC,NXP USA Inc.
Series MPC85xx MPC8xx
Part Status Obsolete Obsolete
Core Processor PowerPC e500 MPC8xx
Number of Cores / Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 833MHz 50MHz
Co - Processors / DSP Communications; CPM Communications; CPM
RAM Controllers DDR, SDRAM DRAM
Graphics Acceleration No No
Ethernet 10/100/1000Mbps (2) 10Mbps (1)
USB - USB 1.x (1)
Voltage - I / O 2.5V, 3.3V 3.3V
Operating Temperature 0°C ~ 105°C (TA) 0°C ~ 95°C (TA)
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