MPC8560VT833LC vs MPC8541ECPXALF

This in-depth comparison of the MPC8560VT833LC and MPC8541ECPXALF provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MPC8560VT833LC

NXP USA Inc.

Lifecycle
Active
Stock
2911 PCS
Package
BBGA-784
Series
Embedded - Microprocessors
+BOM RFQ
Part B

MPC8541ECPXALF

NXP USA Inc.

Lifecycle
Active
Stock
72 PCS
Package
BBGA-783
Series
Embedded - Microprocessors
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MPC8560VT833LC MPC8541ECPXALF
Supplier - Flip Electronics,NXP USA Inc.
Series MPC85xx MPC85xx
Part Status Obsolete Obsolete
Core Processor PowerPC e500 PowerPC e500
Number of Cores / Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 833MHz 667MHz
Co - Processors / DSP Communications; CPM Security; SEC
RAM Controllers DDR, SDRAM DDR, SDRAM
Graphics Acceleration No No
Ethernet 10/100/1000Mbps (2) 10/100/1000Mbps (2)
Voltage - I / O 2.5V, 3.3V 2.5V, 3.3V
Operating Temperature 0°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Security Features - Cryptography, Random Number Generator
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