MPC860PVR80D4 vs MPC860DEVR66D4

This in-depth comparison of the MPC860PVR80D4 and MPC860DEVR66D4 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MPC860PVR80D4

+BOM

4232 PCS | NXP USA Inc.
MPC860DEVR66D4

+BOM

4423 PCS | Freescale Semiconductor
Package BGA-357
Description IC MPU MPC8XX 80MHZ 357BGA POWERQUICC RISC MICROPROCESSOR
Supplier - Rochester Electronics, LLC
Series MPC8xx Bulk
ProductStatus Obsolete MPC86xx
CoreProcessor MPC8xx Active
NumberofCores/BusWidth 1 Core, 32-Bit MPC8xx
Speed 80MHz 1 Core, 32-Bit
Co-Processors/DSP Communications; CPM 66MHz
RAMControllers DRAM Communications; CPM
GraphicsAcceleration No DRAM
Display&InterfaceControllers - No
SATA - 10Mbps (2)
OperatingTemperature 0°C ~ 95°C (TA) 3.3V
SecurityFeatures - 0°C ~ 95°C (TJ)
Ethernet 10Mbps (4), 10/100Mbps (1) -
Voltage-I/O 3.3V -
Comparison Model : MPC860PVR80D4 MPC860DEVR66D4

+BOM RFQ