MPC860PVR80D4 vs MPC860DEVR66D4

This in-depth comparison of the MPC860PVR80D4 and MPC860DEVR66D4 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MPC860PVR80D4

NXP USA Inc.

Lifecycle
Active
Stock
4232 PCS
Package
BGA-357
Series
Embedded - Microprocessors
+BOM RFQ
Part B

MPC860DEVR66D4

Freescale Semiconductor

Lifecycle
Active
Stock
4423 PCS
Series
Embedded - Microprocessors
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MPC860PVR80D4 MPC860DEVR66D4
Supplier - Rochester Electronics, LLC
Series MPC8xx Bulk
Part Status Obsolete MPC86xx
Core Processor MPC8xx Active
Number of Cores / Bus Width 1 Core, 32-Bit MPC8xx
Speed 80MHz 1 Core, 32-Bit
Co - Processors / DSP Communications; CPM 66MHz
RAM Controllers DRAM Communications; CPM
Graphics Acceleration No DRAM
Display&Interface Controllers - No
SATA - 10Mbps (2)
Operating Temperature 0°C ~ 95°C (TA) 3.3V
Security Features - 0°C ~ 95°C (TJ)
Ethernet 10Mbps (4), 10/100Mbps (1) -
Voltage - I / O 3.3V -
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