MPC860PVR80D4 vs MPC860PVR66D4 Comparison

This in-depth comparison of the MPC860PVR80D4 and MPC860PVR66D4 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MPC860PVR80D4

+BOM

4232 PCS | NXP USA Inc.
MPC860PVR66D4

+BOM

9094 PCS | Freescale Semiconductor
Package BGA-357 BBGA-357
Description IC MPU MPC8XX 80MHZ 357BGA POWERQUICC 32 BIT POWER ARCHITEC
Supplier - Rochester Electronics, LLC
Series MPC8xx MPC86xx
Part Status Obsolete Active
Core Processor MPC8xx MPC8xx
Number of Cores / Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 80MHz 66MHz
Co - Processors / DSP Communications; CPM Communications; CPM
RAM Controllers DRAM DRAM
Graphics Acceleration No No
Ethernet 10Mbps (4), 10/100Mbps (1) 10Mbps (4), 10/100Mbps (1)
Voltage - I / O 3.3V 3.3V
Operating Temperature 0°C ~ 95°C (TA) 0°C ~ 95°C (TJ)
Comparison Model : MPC860PVR80D4 MPC860PVR66D4

+BOM RFQ