MPC860TVR50D4 vs MPC860DEVR66D4 Comparison

This in-depth comparison of the MPC860TVR50D4 and MPC860DEVR66D4 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MPC860TVR50D4

+BOM

2566 PCS | NXP USA Inc.
MPC860DEVR66D4

+BOM

4423 PCS | Freescale Semiconductor
Package BGA-357
Description IC MPU MPC8XX 50MHZ 357BGA POWERQUICC RISC MICROPROCESSOR
Supplier - Rochester Electronics, LLC
Series MPC8xx Bulk
Part Status Obsolete MPC86xx
Core Processor MPC8xx Active
Number of Cores / Bus Width 1 Core, 32-Bit MPC8xx
Speed 50MHz 1 Core, 32-Bit
Co - Processors / DSP Communications; CPM 66MHz
RAM Controllers DRAM Communications; CPM
Graphics Acceleration No DRAM
Display&Interface Controllers - No
SATA - 10Mbps (2)
Operating Temperature 0°C ~ 95°C (TA) 3.3V
Security Features - 0°C ~ 95°C (TJ)
Ethernet 10Mbps (4), 10/100Mbps (1) -
Voltage - I / O 3.3V -
Comparison Model : MPC860TVR50D4 MPC860DEVR66D4

+BOM RFQ